Nelco N5000

BT Epoxy Laminate & Prepreg

N5000 BT epoxy laminate and prepreg provides superior electrical properties for high density aviation, aerospace and commercial boards which require close thickness tolerance and the ability to withstand the stress of multiple soldering excursions and repeated chemical exposure.

BT Resin Chemistry:

    • BT (bismaleimide triazine) provides low Dk and Df values and overall superior electrical properties

Excellent Reliability and Performance:

    • Suitable for lead-free assembly applications and designs

    • Tg 185°C by DSC

    • Low Dk and Df

    • Reduced X/Y and Z-Axis expansion

CAF Resistant:

    • Low Z-CTE and proven CAF resistance provide long-term reliability

Wide Processing Latitude:

    • Unique BT / epoxy blend results in a wide processing latitude

    • 90 min press at 190°C and 200-350 psi

Benefits:

    • BT Resin Chemistry, Low Dk/Df

    • Suitable for Lead-Free Processing

    • BT / Epoxy Blend for Improved Processing

    • CAF Resistant and Low Z-CTE

Applications:

    • Fine-Line and High-Density PCBs

    • Backplanes

    • Surface-Mount and BGA Multilayers

    • MCM-Ls / Direct Chip Attach

    • Wireless Communications